![](/img/cover-not-exists.png)
[IEEE 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 - Singapore (9-13 July 2001)] Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548) - Characterization of Cu extrusion failure mode in dual-damascene Cu/low-k interconnects under electromigration reliability test
Jeung-Woo Kim,, Won-Sang Song,, Sam-Young Kim,, Hyan-Soo Kim,, Hyun-Goo Jeon,, Chae-Bog Lim,Year:
2001
Language:
english
DOI:
10.1109/ipfa.2001.941480
File:
PDF, 558 KB
english, 2001