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[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Modeling, simulation and calibration of the chip encapsulation molding process
Roellig, Mike, Meyer, Sebastian, Thiele, Michael, Rzepka, Sven, Wolter, Klaus-JuergenYear:
2009
Language:
english
DOI:
10.1109/esime.2009.4938462
File:
PDF, 12.55 MB
english, 2009