[IEEE 2004 IEEE International Reliability Physics Symposium. - Phoenix, AZ, USA (25-29 April 2004)] 2004 IEEE International Reliability Physics Symposium. Proceedings - Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
Hu, C.-K., Canaperi, D., Chen, S.T., Gignac, L.M., Herbst, B., Kaldor, S., Krishnan, M., Liniger, E., Rath, D.L., Restaino, D., Rosenberg, R., Rubino, J., Seo, S.-C., Simon, A., Smith, S., Tseng, W.-TYear:
2004
Language:
english
DOI:
10.1109/relphy.2004.1315327
File:
PDF, 581 KB
english, 2004