[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - A double metal process: using a TiW/Mo sandwich as the first layer metal
Hawley, F., Levi, A., Vasche, G., Caywood, J.M., Houck, B., Boyce, J., Tso, L.Year:
1988
DOI:
10.1109/vmic.1988.14186
File:
PDF, 394 KB
1988