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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The application of the optimal design for twin die stacked package
Chen, Rong-Sheng, Huang, Chi-Huang, Xie, Yue-ZheYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699557
File:
PDF, 247 KB
english, 2010