Materials and Processes Issues in Fine Pitch Eutectic...

IEEE Transactions on Components and Packaging Technologies 2006 / 12 Vol. 29; Iss. 4

Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection

Liu, Changqing, Hendriksen, M. W., Hutt, David A., Conway, Paul P., Whalley, David C
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.885973
Date:
December, 2006
File:
PDF, 2.96 MB
english, 2006
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