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[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - A novel CMP application on the fabrication of dual-damascene structures for advanced copper/low-k interconnections
Shao-Chung Hu,, Hsueh-Chung Chen,, Liang-Yuan Fang,, Chien-Mei Wang,, Cheng-Yu Hung,, Wen-Yi Hsieh,, Po-Wen Yen,Year:
2002
Language:
english
DOI:
10.1109/iitc.2002.1014949
File:
PDF, 263 KB
english, 2002