An Embrittlement Mechanism of Impact Fracture of Sn–Ag–Cu Solder Joints on BGA Using Electroplated Ni/Au Surface Finishes
Yamamoto, Kenichi, Akahoshi, Haruo, Kato, Takahiko, Kawamura, Toshinori, Koizumi, Masahiro, Satoh, RyoheiVolume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.2004962
Date:
December, 2008
File:
PDF, 2.43 MB
english, 2008