![](/img/cover-not-exists.png)
[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - A diplexer by various embedding method
Chan-Sei Yoo,, Se-Hoon Park,, Woo-Sung Lee,, Jun-Chul Kim,, Nam-Kee Kang,, Jong-Chul Park,Year:
2008
Language:
english
DOI:
10.1109/edaps.2008.4736030
File:
PDF, 2.07 MB
english, 2008