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[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Wafer-level TSV connectivity test using ring oscillator scheme
Pak, Jun So, Cho, Jonghyun, Kim, Joohee, Kim, Heegon, Kim, Kiyeong, Kim, Joungho, Lee, Junho, Park, KunwooYear:
2012
Language:
english
DOI:
10.1109/epeps.2012.6457883
File:
PDF, 593 KB
english, 2012