Improvement of Electrochemical Migration Resistance by...

IEEE Transactions on Device and Materials Reliability 2014 / 03 Vol. 14; Iss. 1

Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Compound Barrier on Cu in Printed Circuit Board

Jung, Min-Suk, Lee, Shin-Bok, Lee, Ho-Young, Ryu, Chang-Sup, Ko, Young-Gwan, Park, Hyung-Wook, Joo, Young-Chang
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2012.2202906
Date:
March, 2014
File:
PDF, 1.18 MB
english, 2014
Conversion to is in progress
Conversion to is failed