[IEEE 2014 IEEE 64th Electronic Components and Technology...

  • Main
  • [IEEE 2014 IEEE 64th Electronic...

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions

Cui, Tong, Syed, Ahmer, Keser, Beth, Alvarado, Rey, Xu, Steven, Schwarz, Mark
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897273
File:
PDF, 1023 KB
english, 2014
Conversion to is in progress
Conversion to is failed