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[IEEE Technology of Integrated Systems in Nanoscale Era (DTIS) - Athens, Greece (2011.04.6-2011.04.8)] 2011 6th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS) - How significant will be the test cost share for 3D die-to-wafer stacked-ICs?
Taouil, Mottaqiallah, Hamdioui, Said, Marinissen, Erik JanYear:
2011
Language:
english
DOI:
10.1109/dtis.2011.5941432
File:
PDF, 310 KB
english, 2011