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[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Recent advances in surface and thin film analysis methods for application to packaging problems
Von Criegern, R., Budde, K., Hoesler, W., Holzapfel, W.Year:
1997
Language:
english
DOI:
10.1109/eptc.1997.723921
File:
PDF, 821 KB
english, 1997