[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Effect of die attach material on heavy Cu wire bonding with Au coated Pd bond pad in automotive applications
Kumar, B. Senthil, Albert, Acuesta, Hong Geraldine, Lim LayYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745794
File:
PDF, 2.82 MB
english, 2013