Tolerance Analysis Method for Passive Alignment of Photonic...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 4 Vol. 4; Iss. 4

Tolerance Analysis Method for Passive Alignment of Photonic Chips

van Gurp, Johan Frederik Cornelis, Tichem, Marcel, Staufer, Urs
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2295524
Date:
April, 2014
File:
PDF, 1.49 MB
english, 2014
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