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[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Challenges in cavity-down thermally enhanced packages containing low-k die
Lee, Chu-Chung, Tu Anh Tran,, Yuan Yuan,, Chin Teck Siong,Year:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702606
File:
PDF, 2.98 MB
english, 2010