[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling
Pin, S., Sartor, M., Michel, L., Parain, J., Dareys, S.Year:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813820
File:
PDF, 1.94 MB
english, 2014