[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Prediction of the Influence of Induced Stresses in Silicon on CMOS Performance in a Cu-Through-Via Interconnect Technology
Okoro, Chukwudi, Gonzalez, Mario, Vandevelde, Bart, Swinnen, Bart, Eneman, Geert, Verheyen, Peter, Beyne, Eric, Vandepitte, DirkYear:
2007
Language:
english
DOI:
10.1109/esime.2007.360030
File:
PDF, 6.61 MB
english, 2007