[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical &...

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[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics

Unterhofer, Katrin, Preu, Harald, Walter, Jurgen, Lorenz, Georg, Mack, Walter, Petzold, Matthias
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Year:
2012
DOI:
10.1109/esime.2012.6191710
File:
PDF, 7.35 MB
2012
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