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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Flip-chip on board packaging of a thermal wind sensor
Guang-ping Shen,, Ming Qin,, Qing-An Huang,, Hua Zhang,, Jian Wu,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4606948
File:
PDF, 647 KB
english, 2008