Study on the Effects of Wafer Thinning and Dicing on Chip...

IEEE Transactions on Advanced Packaging 2006 / 02 Vol. 29; Iss. 1

Study on the Effects of Wafer Thinning and Dicing on Chip Strength

Chen, S., Tsai, C.Z., Wu, E., Shih, I.G., Chen, Y.N.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.849552
Date:
February, 2006
File:
PDF, 1.43 MB
english, 2006
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