Advanced methods for mechanical and structural...

Microelectronics Reliability 2014 / 09 Vol. 54; Iss. 9-10

Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

Sander, C., Standke, Y., Niese, S., Rosenkranz, R., Clausner, A., Gall, M., Zschech, E.
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.07.124
Date:
September, 2014
File:
PDF, 1.67 MB
english, 2014
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