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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Reliability study of high-end Pb-free CBGA solder joint under various thermal cycling test conditions
Dongji Xie,, Gektin, Vadim, Geiger, DavidYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074004
File:
PDF, 1.77 MB
english, 2009