Substrate interconnect technologies for 3-D MEMS packaging

Substrate interconnect technologies for 3-D MEMS packaging

Brian Morgan, Xuefeng Hua, Tomohiro Iguchi, Taizo Tomioka, Gottlieb S. Oehrlein, Reza Ghodssi
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Volume:
81
Year:
2005
Language:
english
Pages:
11
DOI:
10.1016/j.mee.2005.04.004
File:
PDF, 371 KB
english, 2005
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