![](/img/cover-not-exists.png)
Substrate interconnect technologies for 3-D MEMS packaging
Brian Morgan, Xuefeng Hua, Tomohiro Iguchi, Taizo Tomioka, Gottlieb S. Oehrlein, Reza GhodssiVolume:
81
Year:
2005
Language:
english
Pages:
11
DOI:
10.1016/j.mee.2005.04.004
File:
PDF, 371 KB
english, 2005