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[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Study on coined solder bumps on micro-via PCBs
Jae-Woong Nah,, Paik, K.W., Won-Hoe Kim,, Ki-Rok Hur,Year:
2001
Language:
english
DOI:
10.1109/emap.2001.983969
File:
PDF, 917 KB
english, 2001