![](/img/cover-not-exists.png)
Nondestructive characterization of sub-surface damage in rotational ground silicon wafers by laser acoustics
Dietmar Paehler, Dieter Schneider, Maurice HerbenVolume:
84
Year:
2007
Language:
english
Pages:
15
DOI:
10.1016/j.mee.2006.11.001
File:
PDF, 981 KB
english, 2007