[IEEE 7th. Int. Conf. on Thermal, Mechanical and...

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[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Numerical Simulation of Capillary and Fluid Dynamic Forces on Tiny Chips in Fluidic Self-Assembly Process

Tay, A.A.O., Hua Li,, Xiangyang Gao,, Chen, J., Kripesh, V.
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Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1643995
File:
PDF, 4.26 MB
english, 2006
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