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Investigation of interfacial reaction between Au–Sn solder and Kovar for hermetic sealing application
Jeong-Won Yoon, Seung-Boo JungVolume:
84
Year:
2007
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2007.05.058
File:
PDF, 1.44 MB
english, 2007