Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach
M.O. Bloomfield, D.N. Bentz, J.-Q. Lu, R.J. Gutmann, T.S. CaleVolume:
84
Year:
2007
Language:
english
Pages:
7
DOI:
10.1016/j.mee.2007.06.006
File:
PDF, 468 KB
english, 2007