Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base
Chi, Chun-Chuan, Marinissen, Erik Jan, Goel, Sandeep Kumar, Wu, Cheng-WenVolume:
22
Language:
english
Journal:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
DOI:
10.1109/tvlsi.2013.2293192
Date:
November, 2014
File:
PDF, 2.80 MB
english, 2014