Process development in metal/BCB multilayer...

Microelectronic Engineering 2009 Vol. 86; Iss. 3

Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate

Xiaoyun Ding, Fei Geng, Le Luo
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Volume:
86
Year:
2009
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2008.11.005
File:
PDF, 658 KB
english, 2009
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