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Removal of post-etch 193 nm photoresist in porous low-k dielectric patterning using UV irradiation and ozonated water
E. Kesters, Q.T. Le, M. Lux, L. Prager, G. VereeckeVolume:
87
Year:
2010
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2009.11.051
File:
PDF, 507 KB
english, 2010