Texture characterization of Cu interconnects with different...

Microelectronic Engineering 2011 Vol. 88; Iss. 5

Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

Christopher J. Wilson, Chao Zhao, Henny Volders, Larry Zhao, Kristof Croes, Zsolt Tőkei, Gerald P. Beyer
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Volume:
88
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2010.06.014
File:
PDF, 794 KB
english, 2011
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