Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu...

Microelectronic Engineering 2011 Vol. 88; Iss. 5

Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements

H. Wojcik, U. Merkel, A. Jahn, K. Richter, M. Junige, C. Klein, J. Gluch, M. Albert, F. Munnik, C. Wenzel, J.W. Bartha
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Volume:
88
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2010.06.034
File:
PDF, 616 KB
english, 2011
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