[IEEE 2008 58th Electronic Components and Technology...

  • Main
  • [IEEE 2008 58th Electronic Components...

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Packaging of electronic modules through completely dry process

Katsuhiro Maekawa,, Mamoru Mita,, Kazuhiko Yamasaki,, Tomotake Niizeki,, Yorishige Matsuba,, Nobuto Terada,, Hiroshi Saito,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550090
File:
PDF, 2.37 MB
english, 2008
Conversion to is in progress
Conversion to is failed