[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Packaging of electronic modules through completely dry process
Katsuhiro Maekawa,, Mamoru Mita,, Kazuhiko Yamasaki,, Tomotake Niizeki,, Yorishige Matsuba,, Nobuto Terada,, Hiroshi Saito,Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550090
File:
PDF, 2.37 MB
english, 2008