Evaluation new corner stress relief structure layout for high robust metallization
Hein, V., Kludt, J., Weide-Zaage, K.Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.07.039
Date:
September, 2014
File:
PDF, 2.33 MB
english, 2014