Thermal analysis of COB array soldered on heat sink
He, Fan, Chen, Qinghua, Liu, Juanfang, Liu, JiaoVolume:
59
Language:
english
Journal:
International Communications in Heat and Mass Transfer
DOI:
10.1016/j.icheatmasstransfer.2014.10.021
Date:
December, 2014
File:
PDF, 1.70 MB
english, 2014