Study of the UBM to copper interface robustness of solder bumps in flip chip packages
Dreybrodt, J., Dupraz, Y.Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.07.114
Date:
September, 2014
File:
PDF, 798 KB
english, 2014