Robust Electromigration reliability through engineering...

Microelectronics Reliability 2014 / 09 Vol. 54; Iss. 9-10

Robust Electromigration reliability through engineering optimization

Ng, Wee Loon, Tee, Kheng Chok, Liu, Junfeng, Ee, Yong Chiang, Aubel, Oliver, Tan, Chuan Seng, Pey, Kin Leong
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.07.096
Date:
September, 2014
File:
PDF, 1.28 MB
english, 2014
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