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[IEEE 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (9-12 March 1997)] Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Electrical performance in time domain of subminiature interconnections on new thin films
Salik, R., Ferrari, P., Chosson, A., Angnieux, G.Year:
1997
Language:
english
DOI:
10.1109/isapm.1997.581279
File:
PDF, 338 KB
english, 1997