Dynamic thermal modelling of a power integrated circuit...

Microelectronics Journal 2009 Vol. 40; Iss. 7

Dynamic thermal modelling of a power integrated circuit with the application of structure functions

Marcin Janicki, Jedrzej Banaszczyk, Gilbert De Mey, Marek Kaminski, Bjorn Vermeersch, Andrzej Napieralski
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Volume:
40
Year:
2009
Language:
english
Pages:
6
DOI:
10.1016/j.mejo.2008.05.005
File:
PDF, 629 KB
english, 2009
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