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[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Microwave frequency crosstalk model of redistribution line patterns on Wafer Level Package
Myunghee Sung,, Namhoon Kim,, Junwoo Lee,, Baekkyu Choi,, Ikseong Park,, Joon-Ki Hong,, Yongtae Kwon,, Kwang Seong Choi,, Joungho Kim,Year:
2001
Language:
english
DOI:
10.1109/epep.2001.967623
File:
PDF, 349 KB
english, 2001