![](/img/cover-not-exists.png)
[IEEE 2011 IEEE 9th International Conference on ASIC (ASICON 2011) - Xiamen, China (2011.10.25-2011.10.28)] 2011 9th IEEE International Conference on ASIC - Through-Silicon-Via assignment for 3D ICs
Jianchang Ao,, Sheqin Dong,, Chen, Song, Satoshi Goto,Year:
2011
Language:
english
DOI:
10.1109/asicon.2011.6157194
File:
PDF, 374 KB
english, 2011