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[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Spin-on dielectric liner TSV for 3D wafer level packaging applications
Civale, Yann, Majeed, Bivragh, Tezcan, Deniz S., Soussan, Philippe, Beyne, EricYear:
2010
Language:
english
DOI:
10.1109/iitc.2010.5510314
File:
PDF, 1.72 MB
english, 2010