![](/img/cover-not-exists.png)
[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Studies of Solder Joint Reliability under Mechanical Bending Test on FR-4 PCBs with Sn-4.0Ag-0.5Cu Solder Paste
Chen, Si, Sun, Peng, Wei, Xicheng, Cheng, Zhaonian, Liu, JohanYear:
2007
Language:
english
DOI:
10.1109/hdp.2007.4283622
File:
PDF, 1.13 MB
english, 2007