[IEEE 2004 International IEEE Conference on the Asian Green Electronics (AGEC) - Hong Kong, China & Shenzhen, China (5-6 Jan. 2004 & 7-9 Jan. 2004)] Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC) - Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist
Jung-Sub Lee,, Kun-Mo Chu,, Hyo-Hoon Park,, Duk Young Jeon,Year:
2004
Language:
english
DOI:
10.1109/agec.2004.1290883
File:
PDF, 386 KB
english, 2004