[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Phase change materials as a viable thermal interface material for high-power electronic applications
Ramaswamy, C., Shinde, S., Pompeo, F., Sablinski, W., Bradley, S.Year:
2004
Language:
english
DOI:
10.1109/itherm.2004.1318354
File:
PDF, 372 KB
english, 2004