Moisture-induced failures of adhesive flip chip interconnects
Teh, L.K., Teo, M., Anto, E., Wong, C.C., Mhaisalkar, S.G., Teo, P.S., Wong, E.H.Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848572
Date:
September, 2005
File:
PDF, 4.00 MB
english, 2005