Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)
Ching-Yu Ni,, Ki-Sang Yoon,, Hyo-Jung Ahn,, Ching-I Chen,Volume:
28
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2005.848472
Date:
April, 2005
File:
PDF, 1.42 MB
english, 2005